樂泰3517
LOCTITE 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.
Chemical Type: Epoxy
Appearance (uncured): Black liquidLMS
Components :One component - requires no mixing
Cure: Heat cure
Cure Benefit :Production - high speed curing
Application :Underfill
Specific Application :Reworkable underfill for CSP (FBGA) or BGA
Dispense Method :Syringe
Key Substrates: SMD components to PCB
樂泰電子市場產(chǎn)品:底部填充膠、貼片紅膠、攝像模組膠、黑膠、導(dǎo)電膠、UV紫外固化膠、筆記本用膠方案、手機(jī)用膠方
案。