田村 tamura 低銀錫膏GP-216-HF17 衡鵬企業(yè)為您供應(yīng) LFSOLDER GP-216-HF17 is a Pb-free and cleaning-free Table 1 Characteristics Fig.1 SEM photograph of solder powder solder paste used Pb-free spherical solde powder and flux. Since this solder paste contains no Pb, the usage of hazardous materials is reduced, furthermore, the and the safe workplace are protected. As its flux residue contains no halides, it can be remained on the PCB 　 heater and conveyor during reflowing. 　 temperature. ● Superior reliability is provided by no washing. ● Stable printability with little change in viscosity ?? during continuous printing. ● Pb-free (Sn/Ag/Cu series) solder alloy is used. ● Excellent wettability for electronic component and land p ● Having a good solderability even in air reflow. ● Excellent solderability can be attained for a high peak 2.Outstanding features cleaning. Items Characteristics Test methods Alloy composition Sn96.8/Ag0.3/Cu0.7/Bi2.0/In0.2 JIS Z 3282??1999 Melting point 210??224?? According to DSC Particle size of solder powder 20-36μm According to laserdiffraction method Flux content 12.5% JIS??Z??3284 (1994) Chlorine content 0.0?? JIS??Z??3197??(1999) Viscosity 200Pa??s Annex 6 to JIS Z 3284 (1994)